The Korean manufacturer also revealed that it has found no over-heating issues with Qualcomm Snapdragon 810 processor, which is used in G Flex 2 and was said to have been dropped from Galaxy S6 after heating problems. LG stated that during its testing G Flex 2 actually emitted less heat than existing devices.
“I am very much aware of the various concerns in the market about the (Snapdragon) 810, but the chip’s performance is quite satisfactory,” Woo Ram-chan, LG vice president for mobile product planning, told reporters at a press event in South Korea.
In addition to the Snapdragon 810, LG G Flex 2 features a 5.5-inch full HD P-OLED curved display, Android 5.0, 13MP rear camera with OIS+, 2.1MP front shooter and 3000 mAh battery. The phone also includes support for tri-band LTE-A connectivity.
There is no word on the release of G Flex 2 in other markets right now.
