HTC’s recently rumoured One M8 Prime smartphone is back in news and this time, @evleaks has shared some details about the material being used in the chassis of the phone.

According to the leaker, HTC One M8 Prime will be made of aluminium-silicon material, which is said to be stronger and lighter than aluminium and offers precision surface treatment. Exact details about it are unclear right now but we expect the company to discuss it in detail at the official unveiling.

Among other new revelations, the smartphone is said to waterproof like most recent flagships and will include LTE Advanced Category 6 modem (Qualcomm Gobi 9×35 likely), which supports download speeds of up to 300Mbps.

As per previous leaks, HTC One M8 Prime is rumoured to pack a 5.5-inch QHD display, 3GB of RAM, and 2.5GHz quad-core Snapdragon 805 processor. The phone is also expected to pack 16GB of on-board storage, HTC Duo camera with 16MP depth sensor, up from 2MP front in One (M8).

Prime is reportedly coming in September 2014 and will be competing with the likes of Samsung Galaxy S5 Prime, Note 4, and LG G3.