Many were left impressed with Huawei Ascend P1 and P1 S at Consumer Electronics Show earlier this month and now company is planning to take it another step up at next month’s Mobile World Congress.
According to a statement given to Twice, <cite=”http://www.twice.com/article/479388-Huawei_Readies_Two_Flagship_U_S_Phones.php”the two Ascend phones will be followed by a Diamond series of smartphones that will take performance a step higher and will be revealed at MWC.
Company has already sent out invites for press event scheduled on February 26 and it has promised to launch its “smartest, fastest and most high-performing smartphone”.
There are no specific details on the Diamond series, but if we believe Huawei, these should come with specifications better than the following, which are present in Ascend P1 S:
1.5GHz TI OMAP 4460 processor, Android 4.0, 8MP rear camera with LED flash, 1.3MP front camera, 1GB of RAM, 4GB internal storage, 1800mAh battery and 6.68 mm thickness.
Huawei is clearly showing its A-Game these days and if continues to be on this path, no doubt that it will be the next HTC.